Welcome to ICAMFP 2027
The 4th International Conference on Computer Science and Blockchain
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About ICAMFP 2027
The 2027 International Conference on Advanced Materials and Frontiers of Physics (ICAMFP 2027) will be held in Chengdu, China, from May 28 to 30, 2027. The conference aims to provide an international platform for scholars, researchers, and professionals to exchange the latest achievements, emerging trends, and critical challenges in the fields of advanced materials and frontier physics. It will focus on a wide range of topics, including novel functional materials, nanomaterials, energy materials, quantum materials, condensed matter physics, optoelectronics, and other related interdisciplinary areas. Through keynote speeches, invited talks, oral presentations, and poster sessions, ICAMFP 2027 seeks to promote academic dialogue, foster international collaboration, and inspire innovative ideas that advance both fundamental research and practical applications in materials science and physics.
Important Dates
Full Paper
Submission Date
February
25
2027
Notification of
Acceptance
March
26
2027
Registration
Deadline
April
26
2027
Conference
Dates
May
28-30
2027
Topics
The topics of interest for submission include, but are not limited to:
📚︎ Advanced Materials and Materials Physics
Advanced Materials; Functional Materials; Smart Materials; Nanomaterials; Composite Materials; Material Preparation; Material Characterization; Material Properties; Materials Physics; Applications of New Materials; Semiconductor and Electronic Materials; Optical and Magnetic Materials; Quantum Materials;
📚︎ Condensed Matter Physics and Frontier Physics
Condensed Matter Physics; Quantum Physics; Computational Physics; Theoretical Physics; Experimental Physics; Low-Temperature Physics; Optical Physics; Physical Simulation; Frontiers in Physics; Plasma Physics; Nuclear Physics; Astrophysics; Biophysics; Complex Systems and Statistical Physics; High Energy and Particle Physics; Interdisciplinary Physics Research;
📚︎ Materials Mechanics and Mechanical Properties
Mechanics of Materials; Solid Mechanics; Computational Mechanics; Mechanical Property Analysis; Structural Mechanics; Fracture and Fatigue; Deformation Mechanisms; Multiscale Mechanics; Mechanical Simulation; Engineering Mechanics Applications;
Publication
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
Organizer
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